|
J-STD-003
|
Joint Industry Standard Solderability Tests for Printed Boards
|
IPC
|
ML1-44
|
|
IPC-2141
|
Controlled Impedance Circuit Boards and High Speed Logic Design
|
IPC
|
ML1-29
|
|
IPC-2221
|
Generic Standard on Printed Board Design
|
IPC
|
ML1-01A-B
|
|
IPC-2222
|
Sectional Design Standard on Rigid Organic Printed Boards
|
IPC
|
ML1-02A-B
|
|
IPC-2252
|
Design Guide for RF/Microwave Circuit Boards
|
IPC
|
ML1-45A-B
|
|
IPC-4101
|
Specification for Base Materials for Rigid and Multilayer Printed Boards
|
IPC
|
ML1-03
|
|
IPC-4101A
|
Specification for Base Materials for Rigid and Multilayer Printed Boards
|
IPC
|
ML1-35
|
|
IPC-4101A with Amendment 1
|
Specification for Base Materials for Rigid and Multilayer Printed Boards
|
IPC
|
ML1-46
|
|
IPC-4103
|
Specification for Base Materials for High Speed / High Frequency Applications
|
IPC
|
ML1-36
|
|
IPC-4202
|
Flexible Base Dielectrics for Use in Flexible Printed Circuitry
|
IPC
|
ML1-47
|
|
IPC-4203
|
Adhesive Coated Dielectric Films for Use as Cover Sheets for Flexible Printed Circuitry and Flexible Adhesive Bonding Films
|
IPC
|
ML1-48
|
|
IPC-4204
|
Flexible Metal-Clad Dielectrics for Use in Fabrication of Flexible Printed Circuitry
|
IPC
|
ML1-49
|
|
IPC-4412
|
Specification for Finished Fabric Woven from “E” Glass for Printed Boards
|
IPC
|
ML1-50
|
|
IPC-4552
|
Specification for Electroless Nickel/Immersion Gold (ENIG) Plating for Printed Circuit Board
|
IPC
|
ML1-53
|
|
IPC-6011
|
Generic Performance Specification For Printed Boards
|
IPC
|
ML1-04
|
|
IPC-6012
|
Qualification and Performance Specification for Rigid Printed Boards
|
IPC
|
ML1-05-1A-B
|
|
IPC-6012A
June 1998 |
Qualification and Performance Specification for Rigid Printed Boards
|
IPC
|
ML1-05-2A-B
|
|
IPC-6012A
|
Qualification and Performance Specification for Rigid Printed Boards (with Amendment 1)
|
IPC
|
ML1-34
|
|
IPC-6012B
|
Qualification and Performance Specification for Rigid Printed Boards (August 2004)
|
IPC
|
ML1-54
|
|
IPC-6013
|
Qualification and Performance Specification for Flexible Printed Boards
|
IPC
|
ML1-06
|
|
IPC-6013 with Amendment 1 |
Qualification and Performance Specification for Flexible Printed Boards
|
IPC
|
ML1-43
|
|
IPC-6016
|
Qualification and Performance Specification for High Density Interconnect (HDI) Layers or Boards
|
IPC
|
ML1-07
|
|
IPC-6018
|
Microwave End Product Board Inspection and Test
|
IPC
|
ML1-33
|
|
IPC-6018A (Jan 2002) |
Microwave End Product Board Inspection and Test |
IPC |
ML1-37 |
|
IPC-7711
|
Rework of Electronic Assemblies
|
IPC
|
ML1-08
|
|
IPC-7721
|
Repair and Modification of Printed Boards and Electronic Assemblies
|
IPC
|
ML1-09
|
|
IPC-9201
|
Surface Insulation Resistance Handbook
|
IPC
|
ML1-52
|
|
IPC-9252
|
Guidelines and Requirements for Electrical Testing of Unpopulated Printed Boards
|
IPC
|
ML1-38
|
|
IPC-A-600
(Revision E) |
Acceptability of Printed Boards
|
IPC
|
ML1-10
|
|
IPC-A-600 (Revision F)
|
Acceptability of Printed Boards
|
IPC
|
ML1-39
|
|
IPC-A-600 (Revision G)
|
Acceptability of Printed Boards
|
IPC
|
ML1-55A-B
|
|
IPC-A-610 (Revision D)
|
Acceptability of Electronic Assemblies
|
IPC
|
ML1-57
|
|
IPC-CF-148A
|
Resin Coated Metal Foil for Printed Boards
|
IPC
|
ML1-11
|
|
IPC-D-316
|
Design Guide for Microwave Circuit Boards Utilizing Soft Substrates
|
IPC
|
ML1-30
|
|
IPC-D-317A
|
Design Guidelines for Electronic Packaging Utilizing High-Speed Techniques
|
IPC
|
ML1-31
|
|
IPC-D-356A
|
Bare Substrate Electrical Test Data Format
|
IPC
|
ML1-32
|
|
IPC-DD-135
|
Qualification Testing for Deposited Organic Interlayer Dielectric Materials for Multichip Modules
|
IPC
|
ML1-40
|
|
IPC-DR-570A
|
A General Spec. for 1/8 In. Dia Shank Carbide Drills for PCB
|
IPC
|
ML1-12
|
|
IPC-DR-572
|
Drilling Guidelines for Printed Boards
|
IPC
|
ML1-13
|
|
IPC-EG-140
|
Specification for Finished Fabric Woven from “E” Glass for Printed Boards
|
IPC
|
ML1-41
|
|
IPC-EIA J-STD-032 June 2002 |
Joint Industry Standard – Performance Standard for Ball Grid Array Balls
|
IPC
|
ML1-51
|
|
IPC-J-STD-001D February |
Joint Industry Standard -Requirements for Soldered Electrical and Electrical Assemblies
|
IPC
|
ML1-58
|
|
IPC-ET-652A
November 1999 |
Guidelines and Requirements for Electrical Testing of Unpopulated Printed Boards
|
IPC
|
ML1-14
|
|
IPC-IEC/PAS 62123 (Edition 1.0 1999-10) |
Performance guide Manual for single- and double-sided flexible printed wiring boards |
IPC |
ML1-56 |
|
IPC/JPCA-2315
|
Design Guide for High Density Interconnects (HDI) and Microvias
|
IPC
|
ML1-26
|
|
IPC/JPCA-4104
|
Specification for High Density Interconnect (HDI) and Microvia Materials
|
IPC
|
ML1-25
|
|
IPC/JPCA-6202
|
Performance Guide Manual for Single-Sided and Double-Sided Flexible Printed Wiring Boards
|
IPC
|
ML1-15
|
|
IPC/JPCA-6801
|
Terms and Definitions, Test Methods, and Design Examples for Build-Up/High Density Interconnect (HDI) Printed Wiring Boards
|
IPC
|
ML1-27A-B
|
|
IPC-L-108B
|
Specification for Thin Metal Clad Material for Multilayer Printed Boards
|
IPC
|
ML1-16
|
|
IPC-L-109B
|
Specification for Resin Impregnated Fabric for Multilayer Printed Boards
|
IPC
|
ML1-17
|
|
IPC-L-125A
|
Specification for Plastic Substrates Clad or Unclad for High Speed/High Frequency Interconnections
|
IPC
|
ML1-28
|
|
IPC-MI-660
|
Guideline for Incoming Inspection of Printed Board Material
|
IPC
|
ML1-18
|
|
IPC-QE-605A Feb 1999 |
Printed Board Quality Evaluation Handbook |
IPC |
ML1-19 |
|
IPC-QL-653
|
Qualification of Facilities that Inspect/Test Printed Boards, Components and Materials
|
IPC
|
ML1-20
|
|
IPC-SM-840C
|
Qualification & Performance of Permanent Solder Mask
|
IPC
|
ML1-21
|
|
IPC-T-50F
|
Terms and Definitions for Interconnecting & Packaging Electronic Circuits
|
IPC
|
ML1-22
|
|
IPC-TA-720
|
Technology Assessment Handbook on Laminates
|
IPC
|
ML1-23
|
|
IPC-TM-650
|
Test Methods Manual
|
IPC
|
ML1-24
|
|
IPC-TR-476A
|
Electrochemical Migration: Electrically Induced Failures in Printed Wiring Assemblies
|
IPC
|
ML1-42
|
|
IPC-2141
|
Controlled Impedance Circuit Boards and High Speed Logic Design
|
IPC
|
ML1-29
|
|
IPC-2221
|
Generic Standard on Printed Board Design
|
IPC
|
ML1-01A-B
|
|
IPC-2222
|
Sectional Design Standard on Rigid Organic Printed Boards
|
IPC
|
ML1-02A-B
|
|
IPC-2252
|
Design Guide for RF/Microwave Circuit Boards
|
IPC
|
ML1-45A-B
|
|
IPC-4101
|
Specification for Base Materials for Rigid and Multilayer Printed Boards
|
IPC
|
ML1-03
|
|
IPC-4101A
|
Specification for Base Materials for Rigid and Multilayer Printed Boards
|
IPC
|
ML1-35
|
|
IPC-4101A with Amendment 1
|
Specification for Base Materials for Rigid and Multilayer Printed Boards
|
IPC
|
ML1-46
|
|
IPC-4103
|
Specification for Base Materials for High Speed / High Frequency Applications
|
IPC
|
ML1-36
|
|
IPC-4202
|
Flexible Base Dielectrics for Use in Flexible Printed Circuitry
|
IPC
|
ML1-47
|
|
IPC-4203
|
Adhesive Coated Dielectric Films for Use as Cover Sheets for Flexible Printed Circuitry and Flexible Adhesive Bonding Films
|
IPC
|
ML1-48
|
|
IPC-4204
|
Flexible Metal-Clad Dielectrics for Use in Fabrication of Flexible Printed Circuitry
|
IPC
|
ML1-49
|
|
IPC-4412
|
Specification for Finished Fabric Woven from “E” Glass for Printed Boards
|
IPC
|
ML1-50
|
|
IPC-4552
|
Specification for Electroless Nickel/Immersion Gold (ENIG) Plating for Printed Circuit Board
|
IPC
|
ML1-53
|
|
IPC-6011
|
Generic Performance Specification For Printed Boards
|
IPC
|
ML1-04
|
|
IPC-6012
|
Qualification and Performance Specification for Rigid Printed Boards
|
IPC
|
ML1-05-1A-B
|
|
IPC-6012A
June 1998 |
Qualification and Performance Specification for Rigid Printed Boards
|
IPC
|
ML1-05-2A-B
|
|
IPC-6012A
|
Qualification and Performance Specification for Rigid Printed Boards (with Amendment 1)
|
IPC
|
ML1-34
|
|
IPC-6012B
|
Qualification and Performance Specification for Rigid Printed Boards (August 2004)
|
IPC
|
ML1-54
|
|
IPC-6013
|
Qualification and Performance Specification for Flexible Printed Boards
|
IPC
|
ML1-06
|
|
IPC-6013 with Amendment 1 |
Qualification and Performance Specification for Flexible Printed Boards
|
IPC
|
ML1-43
|
|
IPC-6016
|
Qualification and Performance Specification for High Density Interconnect (HDI) Layers or Boards
|
IPC
|
ML1-07
|
|
IPC-6018
|
Microwave End Product Board Inspection and Test
|
IPC
|
ML1-33
|
|
IPC-6018A (Jan 2002) |
Microwave End Product Board Inspection and Test |
IPC |
ML1-37 |
|
IPC-7711
|
Rework of Electronic Assemblies
|
IPC
|
ML1-08
|
|
IPC-7721
|
Repair and Modification of Printed Boards and Electronic Assemblies
|
IPC
|
ML1-09
|
|
IPC-9201
|
Surface Insulation Resistance Handbook
|
IPC
|
ML1-52
|
|
IPC-9252
|
Guidelines and Requirements for Electrical Testing of Unpopulated Printed Boards
|
IPC
|
ML1-38
|
|
IPC-A-600
(Revision E) |
Acceptability of Printed Boards
|
IPC
|
ML1-10
|
|
IPC-A-600 (Revision F)
|
Acceptability of Printed Boards
|
IPC
|
ML1-39
|
|
IPC-A-600 (Revision G)
|
Acceptability of Printed Boards
|
IPC
|
ML1-55A-B
|
|
IPC-CF-148A
|
Resin Coated Metal Foil for Printed Boards
|
IPC
|
ML1-11
|
|
IPC-D-316
|
Design Guide for Microwave Circuit Boards Utilizing Soft Substrates
|
IPC
|
ML1-30
|
|
IPC-D-317A
|
Design Guidelines for Electronic Packaging Utilizing High-Speed Techniques
|
IPC
|
ML1-31
|
|
IPC-D-356A
|
Bare Substrate Electrical Test Data Format
|
IPC
|
ML1-32
|
|
IPC-DD-135
|
Qualification Testing for Deposited Organic Interlayer Dielectric Materials for Multichip Modules
|
IPC
|
ML1-40
|
|
IPC-DR-570A
|
A General Spec. for 1/8 In. Dia Shank Carbide Drills for PCB
|
IPC
|
ML1-12
|
|
IPC-DR-572
|
Drilling Guidelines for Printed Boards
|
IPC
|
ML1-13
|
|
IPC-EG-140
|
Specification for Finished Fabric Woven from “E” Glass for Printed Boards
|
IPC
|
ML1-41
|
|
IPC-EIA J-STD-032 June 2002 |
Joint Industry Standard – Performance Standard for Ball Grid Array Balls
|
IPC
|
ML1-51
|
|
IPC-ET-652A
November 1999 |
Guidelines and Requirements for Electrical Testing of Unpopulated Printed Boards
|
IPC
|
ML1-14
|
|
IPC-IEC/PAS 62123 (Edition 1.0 1999-10) |
Performance guide Manual for single- and double-sided flexible printed wiring boards |
IPC |
ML1-56 |
|
IPC/JPCA-2315
|
Design Guide for High Density Interconnects (HDI) and Microvias
|
IPC
|
ML1-26
|
|
IPC/JPCA-4104
|
Specification for High Density Interconnect (HDI) and Microvia Materials
|
IPC
|
ML1-25
|
|
IPC/JPCA-6202
|
Performance Guide Manual for Single-Sided and Double-Sided Flexible Printed Wiring Boards
|
IPC
|
ML1-15
|
|
IPC/JPCA-6801
|
Terms and Definitions, Test Methods, and Design Examples for Build-Up/High Density Interconnect (HDI) Printed Wiring Boards
|
IPC
|
ML1-27A-B
|
|
IPC-L-108B
|
Specification for Thin Metal Clad Material for Multilayer Printed Boards
|
IPC
|
ML1-16
|
|
IPC-L-109B
|
Specification for Resin Impregnated Fabric for Multilayer Printed Boards
|
IPC
|
ML1-17
|
|
IPC-L-125A
|
Specification for Plastic Substrates Clad or Unclad for High Speed/High Frequency Interconnections
|
IPC
|
ML1-28
|
|
IPC-MI-660
|
Guideline for Incoming Inspection of Printed Board Material
|
IPC
|
ML1-18
|
|
IPC-QE-605A Feb 1999 |
Printed Board Quality Evaluation Handbook |
IPC |
ML1-19 |
|
IPC-QL-653
|
Qualification of Facilities that Inspect/Test Printed Boards, Components and Materials
|
IPC
|
ML1-20
|
|
IPC-SM-840C
|
Qualification & Performance of Permanent Solder Mask
|
IPC
|
ML1-21
|
|
IPC-T-50F
|
Terms and Definitions for Interconnecting & Packaging Electronic Circuits
|
IPC
|
ML1-22
|
|
IPC-TA-720
|
Technology Assessment Handbook on Laminates
|
IPC
|
ML1-23
|
|
IPC-TM-650
|
Test Methods Manual
|
IPC
|
ML1-24
|
|
IPC-TR-476A
|
Electrochemical Migration: Electrically Induced Failures in Printed Wiring Assemblies
|
IPC
|
ML1-42
|
